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This Item | 560839 | M80806 | 31598 |
|---|---|---|---|
| storage temp. 2-8°C | storage temp. 2-8°C | storage temp. 2-8°C | storage temp. - |
| density 1.017 g/mL at 25 °C (lit.) | density 1.051 g/mL at 25 °C (lit.) | density 0.897 g/mL at 25 °C (lit.) | density - |
| bp 213-214 °C (lit.) | bp - | bp 170-175 °C (lit.) | bp 191 °C/15 mmHg (lit.) |
| refractive index n20/D 1.626 (lit.) | refractive index n20/D 1.611 (lit.) | refractive index n20/D 1.542 (lit.) | refractive index - |
| Quality Level 100 | Quality Level 200 | Quality Level 100 | Quality Level 100 |
General description
Application
Selective etchants for tungsten thin-film metallizations used in semiconductor and microelectronics technology. Etchants are buffered, mildly alkaline ferricyanide-based formulations providing high resolution patterns with minimal undercutting and photoresist compatibility. Etchant is ready to use (no dilution required). Controlled, uniform etching is achieved by immersion or spray etch technique. Etch Capacity (rate declines at ∼70%) of 64 g/gallon. Recommended Operating Temperatures: 20-80 °C (30-40 °C most common).
Preparation Note
1. Select your etching method according to the table below
Etch Rate (Immersion) Etch Rate (Spray)
2. Rinse with DI water
- 20°C = 30 Å/second
- 30°C = 140 Å/second 20°C = 80 Å/second
- 60°C = 250 Å/second
2. Rinse with DI water
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Aquatic Chronic 3 - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A
Supplementary Hazards
Storage Class Code
8B - Non-combustible corrosive hazardous materials
WGK
WGK 2
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Personal Protective Equipment
dust mask type N95 (US), Eyeshields, Gloves
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